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A Product Line of
Diodes Incorporated
ZXLD1366
Block Diagram
?
V IN
R S
D1
L1
5
V IN
4
I SENSE
1
LX
C1
5V
R1
4.7μF
Voltage
regulator
-
+
0.2V
-
+
Low voltage
dete ctor
Adj
3
-
+
MN
Gnd
R4
50K
D1
1.25V
R5
20K
600KHz
-
+
1.35V
R2
R3
2
Figure. 1 Pin Connection for TSOT25 Package
Pin Description
Name
LX
GND
TSOT25
1
2
U-DFN3030-6
1
2, 5
SO-8EP
1
2, 3, 6, 7
Drain of NDMOS switch
Ground (0V)
Function
Multi-function On/Off and brightness control pin:
? Leave floating for normal operation.(V ADJ = V REF = 1.25V giving nominal
average output current I OUTnom = 0.2V/ RS )
ADJ
3
3
4
? Drive to voltage below 0.2V to turn off output current
? Drive with DC voltage (0.3V < V ADJ < 2.5V) to adjust output current from 25%
to 200% of I OUTnom
? Connect a capacitor from this pin to ground to set soft-start time.
Soft start time increases approximately 0.2ms/nF
Connect resistor RS from this pin to VIN to define nominal average output current
I SENSE
4
4
5
I OUTnom = 0.2V /RS .
(Note : R SMIN = 0.2V with ADJ pin open-circuit)
V IN
5
6
8
Input Voltage (6V to 60V). Decouple to ground with 4.7μF of higher X7R ceramic
capacitor close to device.
Exposed Pad (EP) - connected to device substrate.
To improve thermal impedance of package the EP must be connected to power
Pad
-
Pad
Pad
ground but should not be used as the 0V (GND) current path.
It can be left floating but must not be connected to any other voltage other than
0V.
ZXLD1366
Document number: DS31992 Rev. 8 - 2
2 of 30
www.diodes.com
October 2013
? Diodes Incorporated
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